Capabilities Overview
Our facilities in Shenzen, Jiangsu, and Vietnam deliver custom PCB fabrication solutions tailored to your precise requirements. Our expertise and state-of-the-art technology ensure reliable results, whether you need rapid prototyping or high-volume production.
Specifications
- 42 Layers
- 12Oz Copper
- 1.25uM Gold
- 650x1500mm Panel Size
- 0.075mm Layer Registration
Need specifications beyond those listed?
Our engineering team can provide you with a detailed capabilities sheet tailored to your unique project requirements.
Contact Us
HDI and RF PCB Expertise
We specialize in both high-density interconnect (HDI) and radio frequency (RF) PCB fabrication. Our capabilities include blind/buried vias, microvias, and a deep understanding of RF substrate properties (Dk/Df) for controlled impedance designs. We utilize advanced tools to ensure your boards meet strict signal integrity requirements. Let us help you with your next HDI or RF PCB project. Contact us for a tailored solution.
Key Capabilities
- Blind and Buried Vias: Fabrication of various blind and buried via structures to optimize routing density.
- Microvias: Precision laser-drilling of microvias to enable high-density component placement and signal routing.
- Material Selection: Expertise in a wide range of RF-suitable substrates with varying Dk and Df values.
- Controlled Impedance: Accurate impedance calculation and trace design for high-speed and high-frequency applications.
Certifications
Our commitment to quality, performance, and environmental responsibility is demonstrated by our extensive certifications. These include standards for quality management (ISO 9001), medical devices (ISO 13485), automotive quality (IATF 16949), industry workmanship (IPC-A-600/610), and environmental compliance (RoHS, REACH, UL).
- ISO 9001:2015
- ISO 14001:2015
- ISO 13485:2016
- IPC-A-600
- IPC-A-610
- IATF 16949:2016
- RoHS
- IATF
- REACH
- UL